cracks , defectsmay causecracks , defects

Welding defects(passive) caused byWelding defects

solder defects(passive) caused bysolder defects

to defects in the finished productcan leadto defects in the finished product

problems of vacuum fault(passive) caused byproblems of vacuum fault

in deformation of the productresultingin deformation of the product

openings(passive) caused byopenings

substratesUS8647982Mar 10 , 2009Feb 11 , 2014Micron Technology , IncpreventingsubstratesUS8647982Mar 10 , 2009Feb 11 , 2014Micron Technology , Inc

substratesUS8426957Apr 14 , 2011Apr 23 , 2013Tessera , IncpreventingsubstratesUS8426957Apr 14 , 2011Apr 23 , 2013Tessera , Inc

potential damage thereto(passive) caused bypotential damage thereto

a brake pedal pulsation along withwill triggera brake pedal pulsation along with

from the decreased thickness of a waferresultingfrom the decreased thickness of a wafer

to non - uniform lyophilization — a clear disadvantagemay leadto non - uniform lyophilization — a clear disadvantage

several problems for productioncausesseveral problems for production

damage to the fragile semiconductor chipmay causedamage to the fragile semiconductor chip

substratesUS8389398Mar 27 , 2012Mar 5preventingsubstratesUS8389398Mar 27 , 2012Mar 5

in cemented wafer and the degree of intensitycausedin cemented wafer and the degree of intensity

to undesired part deformations rendering the part inoperableleadsto undesired part deformations rendering the part inoperable

member and method of manufacturing the same US7091583B2 ( enpreventingmember and method of manufacturing the same US7091583B2 ( en

substrateUS6972381Jul 9 , 2002Dec 6preventingsubstrateUS6972381Jul 9 , 2002Dec 6

in optical distortionresultingin optical distortion

successful assembly of a die - to - wafer stackcan preventsuccessful assembly of a die - to - wafer stack

like sinkis causedlike sink

to the semiconductor device by thermal stresscausedto the semiconductor device by thermal stress

coolant or vacuum leakscould causecoolant or vacuum leaks

the electronic component and the circuit board and the like ,(passive) caused bythe electronic component and the circuit board and the like ,

a brake pedal pulsation as well as in serious cases bad controls vibrationmay causea brake pedal pulsation as well as in serious cases bad controls vibration

framing issues periodicallycausingframing issues periodically

substrateUS6838767Jun 6 , 2002Jan 4 , 2005Hitachi , LtdpreventingsubstrateUS6838767Jun 6 , 2002Jan 4 , 2005Hitachi , Ltd

substratesUS2009010327423 Jun 200623preventingsubstratesUS2009010327423 Jun 200623

magnetic elements 50preventingmagnetic elements 50

at the time of the resin curingcausedat the time of the resin curing

member and method of manufacturing the same U.S. Classification 257/776 , 257/758 , 257/752preventingmember and method of manufacturing the same U.S. Classification 257/776 , 257/758 , 257/752

from stress changes due to the heat generated by welding , manufacturing tolerances , and the likeresultingfrom stress changes due to the heat generated by welding , manufacturing tolerances , and the like

to some of the most debilitating problems encountered by semiconductor assemblies such as the fracture and separation of solder joints , or the separation of materials followed by moisture ingresscan leadto some of the most debilitating problems encountered by semiconductor assemblies such as the fracture and separation of solder joints , or the separation of materials followed by moisture ingress

alignment , roundness and size Corrects distortion(passive) caused byalignment , roundness and size Corrects distortion

in costly and time - consuming rework to straightencan resultin costly and time - consuming rework to straighten

failures such as cracks in solder , or broken dicecausesfailures such as cracks in solder , or broken dice

cracks in a chip or a Temperature Cycling ( TCmay causecracks in a chip or a Temperature Cycling ( TC

to complications or the impossibility of following process steps once the wafer is bent due non - uniformity of the substrate ( alignment issues , non - uniformity of depositions , etc … ) which can result in yield lossleadsto complications or the impossibility of following process steps once the wafer is bent due non - uniformity of the substrate ( alignment issues , non - uniformity of depositions , etc … ) which can result in yield loss