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Heatcauseswarpage
the factorsinfluencewarpage
Standingwill causewarpage
by a weld(passive) caused bywarpage
metal shrinkage(passive) is caused byWarpage
Welding allowscauseswarpage
the metalcauseswarpage
knownto causewarpage
design problem ... < >causingwarpage
by material and temperature differences between die and wafer(passive) caused bywarpage
welding and heatalways causewarpage
a fancould causewarpage
by non - uniform wall(passive) caused byWarpage
the stressesmay causewarpage
how excess torquemight causewarpage
its heat and thin metalcausewarpage
warpage design problemcausingwarpage
The varying shrinkage rateswill causewarpage
by welding(passive) caused bywarpage
Overpackingcould causewarpage
by cooling contraction(passive) caused bywarpage
design problemcausingwarpage
Uneven dryingwill causewarpage
dryingwill causewarpage
the rotors are heatingcausingwarpage
just heat it up enoughto causewarpage
heat build - upcould causewarpage
the stresses in the metalwill causewarpage
stresses ... the welding processwill causewarpage
by curing shrinkage(passive) caused bywarpage
by the welding(passive) caused bywarpage
shrinkage variations(passive) is caused byWarpage
uneven heatingcausingwarpage
the gluehave setwarpage
by its own weight(passive) caused bywarpage
uneven coolingcan causewarpage
unbalancing the panel either by uneven coating or heating of one side(passive) can be caused byWARPAGE
by unbalancing the panel either by uneven coating or heating of one side(passive) can be causedWARPAGE
only uneven shrinkagecauseswarpage
by the heat(passive) caused bywarpage
to many partcan leadto many part
the top damper ((passive) caused bythe top damper (
thermal stressresultingthermal stress
this issuecan causethis issue
due to hot temperature or high pressurecan resultdue to hot temperature or high pressure
from consistent cooling and heatingresultingfrom consistent cooling and heating
brake drag or " zinnnggggg " needs to be fixed and luckily that 's quite easycausesbrake drag or " zinnnggggg " needs to be fixed and luckily that 's quite easy
issuescan causeissues
from material compositionresultingfrom material composition
from moisture absorptioncould resultfrom moisture absorption
from one or several variances that may occur during the injection - molding processcan resultfrom one or several variances that may occur during the injection - molding process
in ribshave designedin ribs
- in ribshave designed- in ribs
from moisture absorptioncan resultfrom moisture absorption
several problems for productioncausesseveral problems for production
braking to be more difficult and less controlledwas causingbraking to be more difficult and less controlled
the elements(passive) caused bythe elements
bad head gasketwould causebad head gasket
cracks , defectsmay causecracks , defects
reliability issues of the semiconductor device packagemay causereliability issues of the semiconductor device package
to poor yieldsleadsto poor yields
to some of the most debilitating problems encountered by semiconductor assemblies such as the fracture and separation of solder joints , or the separation of materials followed by moisture ingresscan leadto some of the most debilitating problems encountered by semiconductor assemblies such as the fracture and separation of solder joints , or the separation of materials followed by moisture ingress
the plate with the holes to be out of alignment or elsecausesthe plate with the holes to be out of alignment or else
the problems(passive) caused bythe problems
optical distortions is eliminatedcausesoptical distortions is eliminated
Irregular astigmatism(passive) can be caused byIrregular astigmatism