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solder flux that vaporizes during the soldering process and can not escape from the liquid solder layer(passive) are generally caused bySolder voids
when gas or flux is entrapped during soldering , often as a result of water contamination of solder paste(passive) are createdSolder voids
by controlling the time - temperature profile of the oven(passive) may be preventedSolder voids
Use either plated - shut or plugged and capped vias for all the thermal vias on both sides of the boardto preventsolder voids
entrapped gas or flux(passive) are caused bySolder voids
any flux pockets caught inside the jointswould causesolder voids
capped on both sides of the boardto preventsolder voids
Which Prevent Heat Dissipation , Causes Hot Spots , Die Solder Reflow , and Ultimate Diode FAILURE(passive) Are CreatedSolder Voids
the phone ... the keysetsolder microrupteur
having a hotter profile(passive) are caused bySolder Void
the initiation or propagation of damage in the STIM layer or the location of hot spot on the heat generating chipcan ... influencethe initiation or propagation of damage in the STIM layer or the location of hot spot on the heat generating chip
Cell damage from thermal runaway(passive) may be caused byCell damage from thermal runaway
a “ thermal bottleneck ” or an interruption in the normal thermal conductivity of the resistive film , leading to potentially catastrophic hot spots at high power levelscan createa “ thermal bottleneck ” or an interruption in the normal thermal conductivity of the resistive film , leading to potentially catastrophic hot spots at high power levels
deterioration in the performance of semiconductor device and shortening in lifetimemay leaddeterioration in the performance of semiconductor device and shortening in lifetime
to leaksleadto leaks
failure in electric connection between the through hole and the conductive pinmay causefailure in electric connection between the through hole and the conductive pin
free Sn99.3 / Cu0.7sizeleadfree Sn99.3 / Cu0.7size
in poor connectivity with the lead pad 103may resultin poor connectivity with the lead pad 103
an opening in the conductive adhesive 212 that extends between two instances of the isolation region 214 ( e.g. , the two instances of the isolation regions 74 illustrated in FIGcreatesan opening in the conductive adhesive 212 that extends between two instances of the isolation region 214 ( e.g. , the two instances of the isolation regions 74 illustrated in FIG