Loading ...
heat issuescausingsolder failure
cause the motor drive current to increasecausingsolder failure
This structuremay causesoldering failure
the mismatch in CTE of different componentscausesolder failure
no clean temperature stable low temp lead free solder eutectic temperatureleadfree solder
dueto leadfree solder
goingto leadfree solder
Pressure on the broochcan causesolder to break
the moveto leadfree solder
using kesterleadfree solder
50/50 solderleadfree solder
While not as prevalent as thermomechanical solder fatigue , vibration fatigue and cyclic mechanical fatigue are also knownto causesolder failures
Wire cutters , safety goggles ,leadfree solder
Pura ... We are changingto leadfree solder
heatingcan causesolder points
thingspaintedsolder points
heat stress accelerated by(passive) caused bysolder deformation
excessive gold in a solder jointcan causesolder embrittlement
that ... to solder to eithercausessolder embrittlement
eithercausessolder embrittlement
of solder alloys(passive) are composedSolder preforms
solderingcausingsolder voids
Excess heatingcausessolder brittleness
the jointswould causesolder voids
heatingto causesolder reflow
too small copper padseventually causingempty soldering
too small copper padscausingempty soldering
the optical elements ... sufficientto causesolder reflow
to seal specific packages(passive) are designedSolder preforms
by the exposure of the base material(passive) caused bysolder wettability
the stencil printing process(passive) was ... caused bysolder splatter
Transfer overmoldingcausedsolder extrusions
by conventional processes(passive) caused bysolder wettability
tiles (may leadto solder voiding
Too much solder pastewill causesolder
the solder ironcausingsolder t
Rapid heating of soldercausedsolder
to get sufficient heat into the leadto causesolder
of tin and lead alloys(passive) may be composedSolder
to have thixotropic property ( time - dependent shear thinning property(passive) are designedSolder pastes
to the motorsleadsto the motors
for us hackers to tap into an i / o linedesignedfor us hackers to tap into an i / o line
to the bottom of the bulbsleadsto the bottom of the bulbs
from the introduction of the SMT assembly methodresultingfrom the introduction of the SMT assembly method
to be soft soldereddesignedto be soft soldered
diode failurecausediode failure
failure in electric connection between themay causefailure in electric connection between the
to leaksleadto leaks
jointscan leadjoints
device resetscausingdevice resets
ShortCausesShort
I 1 E 1 E 2leadsI 1 E 1 E 2
in attachment between the chip and the substrateresultsin attachment between the chip and the substrate
This Pin(passive) was discovered byThis Pin
a bridge to form between leadscausesa bridge to form between leads
different types of defectscausingdifferent types of defects
failurecausingfailure
excessive heatingwill causeexcessive heating
a reduction of the adhesive strength of the terminationswill causea reduction of the adhesive strength of the terminations
the machinery breakdown(passive) caused bythe machinery breakdown
of Sncomposedof Sn
of Sn and Pbcomposedof Sn and Pb
a malfunctionmay causea malfunction
of the lasersleadsof the lasers
for electronic usedesignedfor electronic use
to enhance reliability and heat transfer through the reduction of voiding underdesignedto enhance reliability and heat transfer through the reduction of voiding under
to enhance reliability and heat transfer through the reductiondesignedto enhance reliability and heat transfer through the reduction
to meet the voiding requirements of today 's high reliability applicationsare designedto meet the voiding requirements of today 's high reliability applications
bad joint quality due to insufficient soldercausesbad joint quality due to insufficient solder
to enhance reliability and heat transfer through the reduction of voiding under bottom termination componentsdesignedto enhance reliability and heat transfer through the reduction of voiding under bottom termination components
the low resistance problem(passive) Could ... be caused bythe low resistance problem
to dry solder jointsleadingto dry solder joints
to the pads on the back of the board with the soldering ironleadsto the pads on the back of the board with the soldering iron
connection failures of the solder or chip displacementwould ... causeconnection failures of the solder or chip displacement
free solderleadfree solder
of gold / lead / tin alloy , indium , or indium / tin alloy as the solder materialcomposedof gold / lead / tin alloy , indium , or indium / tin alloy as the solder material
to the pads with the soldering ironleadsto the pads with the soldering iron
the solder to crackcan causethe solder to crack
without stand - offleadswithout stand - off
the wire to break just past where the solder endswill causethe wire to break just past where the solder ends