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heat issuescausingsolder failure
cause the motor drive current to increasecausingsolder failure
Pressure on the broochcan causesolder to break
a solder mask can also interfere with outgassing in the reflow ovencan causesolder ball splatter
this part of the tinwill causesolder ball
the tipcausessolder to splash when soldering
excessive gold in a solder jointcan causesolder embrittlement
that ... to solder to eithercausessolder embrittlement
The laser energy ... easyto causethe splash of solder paste
of solder alloys(passive) are composedSolder preforms
solderingcausingsolder voids
the jointswould causesolder voids
heatingto causesolder reflow
the optical elements ... sufficientto causesolder reflow
an excessive solder paste volumewill causesolder bridging
solder globulesresultingfrom solder splashes
first(passive) is ... paintedSolder paste
The separated solder paste particlescan potentially causesolder bridging
the problems of undesirable solder globules (resultingfrom solder splashes
to enable low temperature surface mount assembly technology(passive) is designedsolder paste
to seal specific packages(passive) are designedSolder preforms
Elevated temperatures and excessive time at those temperatures during the warm - up and preheating stages can result in inadequate fluxing activity or insufficient protection of solder spheres in the pastecausingsolder balling
generally(passive) are ... causedSolder " splashes
warping(passive) caused bysolder bridging
by warping(passive) caused bysolder bridging
Stencil thicknesscan also causesolder bridging
by the exposure of the base material(passive) caused bysolder wettability
by high temperature(passive) caused bythe soldering splash
by the stencil printing process(passive) was ... caused bysolder splatter
the stencil printing process(passive) was ... caused bysolder splatter
by conventional processes(passive) caused bysolder wettability
Too much solder pastewill causesolder
Rapid heating of soldercausedsolder
to get sufficient heat into the leadto causesolder
of tin and lead alloys(passive) may be composedSolder
to have thixotropic property ( time - dependent shear thinning property(passive) are designedSolder pastes
by molten solder surface tension(passive) caused bysolder
of tin and lead(passive) is composedSolder
of lead or tin(passive) is typically composedSolder
Solder Re - Flow Excessive heathas causedsolder
onto the LEDleadsonto the LED
to the LEDleadsto the LED
Solder ball causes We dcausesSolder ball causes We d
in gapresultingin gap
to terminal cup , observing polarityleadsto terminal cup , observing polarity
leaks and produce burning on coppercausingleaks and produce burning on copper
free soldering pot solder wire drawing machineleadfree soldering pot solder wire drawing machine
of flux and solder powder ( FLUX & SOLDER POWDERmainly composedof flux and solder powder ( FLUX & SOLDER POWDER
diode failurecausediode failure
to leaksleadto leaks
the problemwas causingthe problem
issueswas causingissues
for maximum robustness in reflowspecifically designedfor maximum robustness in reflow
device resetscausingdevice resets
problemscan causeproblems
ShortCausesShort
in attachment between the chip and the substrateresultsin attachment between the chip and the substrate
This Pin(passive) was discovered byThis Pin
Only 10 % of the solder(passive) was caused byOnly 10 % of the solder
a bridge to form between leadscausesa bridge to form between leads
different types of defectscausingdifferent types of defects
failurecausingfailure
a short , andcan causea short , and
93(passive) caused by93
shorts between the terminalscausingshorts between the terminals
shorts(passive) caused byshorts
a short circuitcausesa short circuit
of the lasersleadsof the lasers
for electronic usedesignedfor electronic use
and qualified for the Mydata MY500 Jet Printerare designedand qualified for the Mydata MY500 Jet Printer
and qualified for the MYDATA MY500 Jet Printerdesignedand qualified for the MYDATA MY500 Jet Printer
bad joint quality due to insufficient soldercausesbad joint quality due to insufficient solder
the low resistance problem(passive) Could ... be caused bythe low resistance problem
to dry solder jointsleadingto dry solder joints
to the pads on the back of the board with the soldering ironleadsto the pads on the back of the board with the soldering iron
connection failures of the solder or chip displacementwould ... causeconnection failures of the solder or chip displacement
free solderleadfree solder
of gold / lead / tin alloy , indium , or indium / tin alloy as the solder materialcomposedof gold / lead / tin alloy , indium , or indium / tin alloy as the solder material
to the pads with the soldering ironleadsto the pads with the soldering iron
without stand - offleadswithout stand - off