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Qaagi - Book of Why

Causes

Effects

a creation of a gapmay causesolder splashes

a gap ... since a path of the gap that connects adjacent mounting electrodes 3 is elongated by the presence of the recess 9 as in the module 1 according to the first and second embodiments , it is possibleto preventsolder splashes

Even if a gap is created in the interface between the photosensitive resin and the sealing resin layer , since a path of the gap that connects adjacent mounting electrodes is elongated , it is possibleto preventsolder splashes

Thus , since the recess substantially wedge - shaped in cross section is provided at a boundary between the solder film and the photosensitive resin , it is possible againto preventsolder splashes

Even with this configuration , since the recess substantially wedge - shaped in cross section is provided at the boundary between the plating electrode layer and the photosensitive resin , it is possibleto preventsolder splashes

your print being off pad a bit(passive) are generally caused bySolder " splashes

a module designedto preventsolder splashes

Semiconductor device having conductive padsto preventsolder reflowUS8898896

as wiper 100 approaches the side of the solder container at the termination of its wiping stroketo preventsplashing of the solder

movement generated by the sonication process(passive) caused bysolder splash

Oct 18 , 2013Apr 23 , 2015International Business Machines CorporationStructureto preventsolder extrusionCN103021888A

additional soldercan causesolder splash

preventing wallto preventsplash of solder

Gas instinct escape in the solder jointcan causesolder splash

Nice job on adding OC protection to the control circuit since it leaves the panel use oily rag on pipeto preventsolder drips

Poor preparation of the housing before solder applicationcan also leadto solder splash

short circuits between elements on the boardmight causeshort circuits between elements on the board

shorts during the fabrication and assembly processescausingshorts during the fabrication and assembly processes

Resistant to chair wheels and short - term temperature resistant against temperature stresses , such as , for example(passive) be caused byResistant to chair wheels and short - term temperature resistant against temperature stresses , such as , for example

a short to ground somewherecausinga short to ground somewhere

wall 52apreventingwall 52a

wall to prevent splash of solderpreventingwall to prevent splash of solder

this probe shortcausingthis probe short

pins 92 and 93(passive) caused bypins 92 and 93

shortingcould causeshorting

wallspreventingwalls

unpredictable defect risk in the future use of electronic productswill causeunpredictable defect risk in the future use of electronic products

wall 51cpreventingwall 51c

wall 51apreventingwall 51a

wall 51bpreventingwall 51b

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