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Pressure on the broochcan causesolder to break
solder with lead soldering lead battery terminalsleadsolder wire
solder manufacturers ... solder wire drawing machine drawing the line color to darkdo leadsolder wire
For Iron A(passive) is composedSolder - Hard
solder manufacturers ... such a problemdo leadsolder wire
excessive gold in a solder jointcan causesolder embrittlement
older manufacturersdo leadsolder wire
with Flux Cored and Residue(passive) is designedSolder wire
eithercausessolder embrittlement
to stressmay leadsolder snap
of solder alloys(passive) are composedSolder preforms
usually(passive) are ... causedSolder peaks
Each of uslead500,000 solder
by a few reasons such as ; not enough flux(passive) are ... caused bySolder peaks
by a few reasons such as ; not enough flux(passive) are ... causedSolder peaks
heatingto causesolder reflow
by a few reasons such as(passive) are ... caused bySolder peaks
the optical elements ... sufficientto causesolder reflow
solder pastemay causesolder balling
The separated solder paste particlescan potentially causesolder bridging
to seal specific packages(passive) are designedSolder preforms
Elevated temperatures and excessive time at those temperatures during the warm - up and preheating stages can result in inadequate fluxing activity or insufficient protection of solder spheres in the pastecausingsolder balling
warping(passive) caused bysolder bridging
also(passive) may ... be causedSolder balling
by the exposure of the base material(passive) caused bysolder wettability
the stencil printing process(passive) was ... caused bysolder splatter
by conventional processes(passive) caused bysolder wettability
Too much solder pastewill causesolder
Rapid heating of soldercausedsolder
to get sufficient heat into the leadto causesolder
of tin and lead alloys(passive) may be composedSolder
by molten solder surface tension(passive) caused bysolder
of tin and lead(passive) is composedsolder
of lead or tin(passive) is typically composedSolder
Solder Re - Flow Excessive heathas causedsolder
Sn / Pb ) or lead - free(passive) can be leadedSolder
by a reduction in temperature(passive) caused bysolder
for electronics use(passive) is designedsolder
boardcausingsolder to
of mostly tin and/or lead(passive) is composedSolder
to bridging and cold solder joints which can be tough to findleadsto bridging and cold solder joints which can be tough to find
to hold up against production with using tin / lead solder anddesignedto hold up against production with using tin / lead solder and
the pins to not " home and lock ... all the way incan causethe pins to not " home and lock ... all the way in
bridging or imbalanced solder that might cause a component not to mountmight causebridging or imbalanced solder that might cause a component not to mount
to terminal cup , observing polarityleadsto terminal cup , observing polarity
to be soft soldereddesignedto be soft soldered
to them before soldering them to the boardleadsto them before soldering them to the board
in a delamination at interfacesresultsin a delamination at interfaces
device resetscausingdevice resets
ShortCausesShort
in attachment between the chip and the substrateresultsin attachment between the chip and the substrate
This Pin(passive) was discovered byThis Pin
a bridge to form between leadscausesa bridge to form between leads
of tin and leadcomposedof tin and lead
of tin and leadcomposedof tin and lead
different types of defectscausingdifferent types of defects
failurecausingfailure
of Sncomposedof Sn
of Sn and Pbcomposedof Sn and Pb
of 63%Tin and 37%Lead meltscomposedof 63%Tin and 37%Lead melts
of the lasersleadsof the lasers
for electronic usedesignedfor electronic use
to enhance reliability and heat transfer through the reduction of voiding underdesignedto enhance reliability and heat transfer through the reduction of voiding under
to enhance reliability and heat transfer through the reductiondesignedto enhance reliability and heat transfer through the reduction
to meet the voiding requirements of today 's high reliability applicationsare designedto meet the voiding requirements of today 's high reliability applications
to capacitance issuescan also leadto capacitance issues
bad joint quality due to insufficient soldercausesbad joint quality due to insufficient solder
to dry solder jointsleadingto dry solder joints
to the pads on the back of the board with the soldering ironleadsto the pads on the back of the board with the soldering iron
connection failures of the solder or chip displacementwould ... causeconnection failures of the solder or chip displacement
free solderleadfree solder
of gold / lead / tin alloy , indium , or indium / tin alloy as the solder materialcomposedof gold / lead / tin alloy , indium , or indium / tin alloy as the solder material
to the pads with the soldering ironleadsto the pads with the soldering iron
without stand - offleadswithout stand - off
the wire to break just past where the solder endswill causethe wire to break just past where the solder ends
on the board / PCBleadson the board / PCB
bad joint qualitycausesbad joint quality
damage at the circuit levelcausingdamage at the circuit level
of tin and leadcomposedof tin and lead
of lead and tincomposedof lead and tin