Loading ...
a variety of tests ... SPI - Short for Solder Paste Inspection , a test for solder paste volume , critical stepto preventsolder errors in PCB assembly
Each solder bump may mate with solder paste on the input / output pad of a printed circuit board in a subsequent reflow operationto createsolder connections between the printed circuit board and the package
the machine place programsetup and placement of the solder paste deposition on PCBs
physical damage to components and enclosuresleadto solder joint failure in PCB assemblies ... and degrade performance of electronic components
Some original limitationshowever ... may causesolder paste volume issue for regular solder paste printing
Discusses alternativesto leadsolder and tin - lead in PCB assembly
The pcb , solder paste and component assembly ... ovencausesthe solder paste to flow and solder the components to the pcb
a relay to turn on the oven fast enoughto causesolder paste to correctly bond to the PCB and components
issuescan causeissues
damage to LED componentto preventdamage to LED component
errors(passive) caused byerrors
Failures(passive) are usually caused byFailures
many types of defects(passive) can be caused bymany types of defects
parasitics(passive) caused byparasitics
freeleadfree