Loading ...
the TCE mismatchcan causea large thermal stress on the solder - lead joints that can lead to joint breakage caused by solder fatigue from temperature cycling operations
a few thousand cyclescausesthermal fatigue cracking in the surface of the die and the appearance of heat checking
these stresses and strainsmay causefatigue cracks at the solder joints or in ceramic components and the de - lamination of the laminate
Paper IVcontributesto increasing the accuracy of thermal fatigue life prediction in solder joints
the solder - lead jointscan leadto joint breakage caused by solder fatigue from temperature cycling operations
jointscan leadto joint breakage caused by solder fatigue from temperature cycling operations
mechanical stress ... in turnleadsto cracks in solder joints , metal fatigue and loose fasteners
The heat from the connectorwill causethe solder joints to fatigue which causes resistance ( and more heat
The most prevalent long - term reliability issuescan causeinterconnect failure are thermal aging and thermo - mechanical fatigue
This conditionresultsin the solder joint fatigue life degradation
the increase in displacementleadsto decrease in the fatigue life of the solder joint
Thermal cyclingmay leadto fatigue cracking of the solder joints , especially with elastic solders
by high power density(passive) caused bythermal fatigue ... and associated circuit failure
melting by the cutting edgeto causebreakage , thermal fatigue , thermal cracking , and the like
severe dynamic loadsmay leadto fatigue failure at leads and solder joints
Thermal striping phenomena caused by mixing of fluids at different temperature is one of the most important issues in design of Fast Breeder Reactors ( FBRsmay causehigh - cycle thermal fatigue in structure and affect the structural integrity
Many factorsmay influencethe fatigue life and mechanical properties of solder joints
thermo - mechanical and shock stresses(passive) caused bysolder - joint fatigue damage
stresses in the leadscan causefatigue and failure at the solder joints
Cyclingcould eventually causefatigue cracking of hard solder joints
the designcausingsolder joint fatigue and component fracture
by the weld(passive) is ... caused bythe scatter of fatigue life of welded joints
The associated mechanical deflections or vibrationcan causecomponent cracking or solder joint fatigue
These differences in thermal expansion coefficients ... the material interfacecan causefatigue cracks in the solder joints and expand
repeated inelastic strains in solder jointsmay causethermal fatigue cracks to initiate and grow in a solder
thermal expansion mismatch between the chip and the substrate(passive) caused bysolder joint fatigue failure
high thermo - mechanical stress gradientscausefatigue failure of the solder joints
large temperature excursions ... high thermo - mechanical stress gradientscausefatigue failure of the solder joints
These stressescan causethermal fatigue and connection failures
different factorsinfluencingfatigue life of welded joints
Thermal cyclingmay leadto fatigue cracking of the solder joints
this thermal cyclingcan causesolder joints to crack and go intermittent
easyto causesolder joint fatigue or solder joint breakage
It has also been observedto causefatigue cracking of solder joints
low - temperature phase formationmay resultin solder joint fatigue and cracks
over timecauseextra fatigue on the solder joint
While it is true that repeatedly turning your PC on and offwill causethermal fatigue effects and shorten its lifespan
a combination of thermal cyclic stress(passive) are caused byTHERMAL FATIGUE Thermal fatigue cracks
a combination of thermal cyclic stress , tensile stress and plastic strain(passive) are caused byTHERMAL FATIGUE Thermal fatigue cracks
maximum temperature ; minimum temperature(passive) is influenced byThermo - mechanical solder joint fatigue
This fault(passive) is caused byThis fault
Electrical failure(passive) was caused byElectrical failure
dry joints ' >causingdry joints ' >
crack and damage in roll ringscausecrack and damage in roll rings
in the phenomenon of dead lightsresultingin the phenomenon of dead lights
fatigue crackscausefatigue cracks
resistance ( and more heatcausesresistance ( and more heat
a decline in coordination , alertness , and performancecausesa decline in coordination , alertness , and performance
stress(passive) caused bystress
some very strange problemscausingsome very strange problems
to severe mold damageleadto severe mold damage
to joint breakage caused by solder fatigue from temperature cycling operationscan leadto joint breakage caused by solder fatigue from temperature cycling operations
to the problemalso contributedto the problem
The C - Drive Bond Head(passive) is designedThe C - Drive Bond Head
such compact constructions comprising the thermally stable polycrystalline diamond material brazed together with a substrate , e.g. , cemented tungsten carbide(passive) to be caused bysuch compact constructions comprising the thermally stable polycrystalline diamond material brazed together with a substrate , e.g. , cemented tungsten carbide
These cracks(passive) are caused byThese cracks
The C - Drive(passive) is designedThe C - Drive
to cracking of the SAC 305 ballswould leadto cracking of the SAC 305 balls
joint breakage(passive) caused byjoint breakage
joint breakage(passive) caused byjoint breakage
to increasing power lossesleadsto increasing power losses
resistance(passive) caused byresistance
breakage(passive) caused bybreakage
Leaks in this area(passive) can be caused by Leaks in this area
Leaks in this area(passive) can be caused byLeaks in this area
in an increase in IMC thickness and a change in morphology into more spherical , dense and with larger grain sizeresultedin an increase in IMC thickness and a change in morphology into more spherical , dense and with larger grain size
to material fatigue at the solder jointsleadsto material fatigue at the solder joints
serious yieldcan causeserious yield
Leaks in the radiator inlet / outlet area(passive) can be caused byLeaks in the radiator inlet / outlet area
Outlet Fitting Leaks in the radiator inlet / outlet area(passive) can be caused byOutlet Fitting Leaks in the radiator inlet / outlet area
the damage(passive) caused bythe damage
Leaky Inlet / Outlet Fitting Leaks in the radiator inlet / outlet area(passive) can be caused byLeaky Inlet / Outlet Fitting Leaks in the radiator inlet / outlet area
the reliability of electronic assembliesinfluencesthe reliability of electronic assemblies
an open circuitcausingan open circuit
in solder failurewill ... resultin solder failure
the crackscausedthe cracks
The electrical failure(passive) is caused byThe electrical failure
resistance ( and more heatcausesresistance ( and more heat
resistance ( and more heatcausesresistance ( and more heat
in process uptimeresultingin process uptime