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the new soldering technique of reflow solderingpaintsolder flux
of at least one organic substance which has at least two --OH groups in a molecule and of which the mass % at the solder melting point of not lower than 170 ° C. ( approximately 180 ° C. ; eutectic solder ) is not less than 18 % as measured by TG in which a flow rate of an air or nitrogen gas atmosphere is 200 ml / min and a rate of temperature rise is(passive) is composedThe soldering flux
projectedto preventsolder - flow US6466124
A cover foil 37preventingthe solder flux
Solder maskwill also preventsolder flow
since they are located close enough to the heating elementto causesolder to flow
The touchpads of the X double as regular mouse buttons , which is also the case with some newer models as of December Limiting use of the ThinkPad outdoors or keeping in its protective case when not used can helppreventsolder flux issues
The surface of the soldering surface 34 is located slightly deeper as the surface of the cover foil 35preventingthe solder flux
the tool heat is transferred to the solder - coated membersto causesolder flow
In order to make this feasible , the solder deposition in the sockets must not require a high temperatureto causesolder flow
b ) , the periphery of the predetermined portion of the solder paste hp is printed , solder resist hrto preventsolder flow
to react with or dissolve metal oxides and impurities on the surfaces being soldered , and to coat the surface to protect it against oxidation(passive) are often designedSolder fluxes
of up to 80 wt % epoxy resin system(passive) is composedThe soldering flux
to help promote the soldering process(passive) is designedThe soldering flux
of a thermosetting epoxy resin and a cross - linking agent with inherent flux activity(passive) is composedThe soldering flux
Evap - Lube 2231(passive) is designedSoldering Fluxes
The adhesive enables sufficient solderingpreventingsolder flow
components ... to temperatures adequateto causeflow of solder
the soldermask(passive) caused bysolder flow
for low temperatures(passive) is designedSoldering flux
sufiiciently highto causesolder flow
onto a portion of the outer surface 38 of the seal member 26 around the primary opening 44 and onto the walls(passive) may be paintedsoldering flux
forming an oxide film on or in depressions in the metal base with a laser beamto preventsolder flow
the pieces themselves ... hot enoughto causesolder to flow
anchor hole and mold cell pairs are closed at one endto preventsolder flow therethrough
The nickel oxide layer 345 and the surface of substrate 310 serve as a barrier or damto preventsolder flow
which are preferably closed at one end thereof by the backing plate 20to preventsolder flow therethrough
reheatedto causesolder to flow
to reduce the formation of oxides that form when you have hot metals in contact with air(passive) is designedSolder flux
to supplement gravity and machine vibration with air pressureto causeflow of the solder
a moat on the die padto preventsolder over flow
1Bto preventflow of solder
This insulating barrier formed by the unexposed photo resist ( 600will preventsolder flux
a residuewill preventsolder flow
that goldsmiths useto preventsolder flowing
using a stop - offto preventsolder flow
a ' patinais preventingsolder flow
the third chromium ... a metal layerpreventsflow of solder
chemical influencesresultingfrom the soldering flux
reliable electrical performance• Nickel - barrier platingto preventsolder flux
a corrosion problem(passive) caused bya corrosion problem
an inward solder projection impedance discontinuity or short between the outer conductor 35 and the inner conductor 19may createan inward solder projection impedance discontinuity or short between the outer conductor 35 and the inner conductor 19
forth in claim 1 whereinsetforth in claim 1 wherein
contact failure problems(passive) caused bycontact failure problems
from surface tension soldering defectsresultingfrom surface tension soldering defects
a release of an active ion contained in an activator when exposed to a high - temperature atmosphere maintaining at a temperature higher than 80 ° C. , for example , an atmosphere of an engine room of an automobile ... and thus makes washing unnecessarypreventsa release of an active ion contained in an activator when exposed to a high - temperature atmosphere maintaining at a temperature higher than 80 ° C. , for example , an atmosphere of an engine room of an automobile ... and thus makes washing unnecessary
no problem as it is not reactiveusually causesno problem as it is not reactive
for use in electronicsdesignedfor use in electronics
strange problems(passive) caused bystrange problems
the problem due to some mA running to resistors or socausedthe problem due to some mA running to resistors or so
forth in claim 1 , which comprises 0.5 to 80 % by weight of the thermoplastic resin and 0.1 to 20 % by weight of the activatorsetforth in claim 1 , which comprises 0.5 to 80 % by weight of the thermoplastic resin and 0.1 to 20 % by weight of the activator
other contact degradation problems(passive) caused byother contact degradation problems
to longer life - High impact flame retardant plastic - Removable shutter optionleadingto longer life - High impact flame retardant plastic - Removable shutter option
to clean water insoluble inorganic residue , organic residue and metal oxides from [ Read Moredesignedto clean water insoluble inorganic residue , organic residue and metal oxides from [ Read More
resistance drift and insulation resistance to ground problemscausesresistance drift and insulation resistance to ground problems
a short cleaned up the area around the solder joints and now working great esammut SOURCEcauseda short cleaned up the area around the solder joints and now working great esammut SOURCE
bridges between the electrodesmay causebridges between the electrodes
or copper foilto leador copper foil
oxidation and to help the solder flowto preventoxidation and to help the solder flow
cold solder joint(passive) created bycold solder joint
the rusting of ferrous and chemical oxidation of non - ferrous metalswill causethe rusting of ferrous and chemical oxidation of non - ferrous metals
free solder wire tin reelleadfree solder wire tin reel
in short circuits between the electrodes ... and/orresultsin short circuits between the electrodes ... and/or
malfunction or degradation of charactermay causemalfunction or degradation of character
very rapid corrosioncausesvery rapid corrosion
soldering chemical , solder paste , lacquer & pcb chemical , metals & alloys , tin / zinc wire , solder preformleadsoldering chemical , solder paste , lacquer & pcb chemical , metals & alloys , tin / zinc wire , solder preform
forth in claim 6 , which comprises 0.5 to 80 % by weight of the thermoplastic resinsetforth in claim 6 , which comprises 0.5 to 80 % by weight of the thermoplastic resin
forth in claim 4 , which comprises 1 to 70 % by weight of at least one compound selected from the group consisting of epoxy group - containing compounds , radical - polymerizable unsaturated double bond - containing compounds and blocked isocyanate compoundssetforth in claim 4 , which comprises 1 to 70 % by weight of at least one compound selected from the group consisting of epoxy group - containing compounds , radical - polymerizable unsaturated double bond - containing compounds and blocked isocyanate compounds
forth in claim 8 , which comprises 0.5 to 70 % by weight of the thermosetting resin and 0.1 to 30 % by weight of the activatorsetforth in claim 8 , which comprises 0.5 to 70 % by weight of the thermosetting resin and 0.1 to 30 % by weight of the activator
PCA corrosion and field failuresto preventPCA corrosion and field failures
corrosion which diminishes the mechanical load - bearing capacity of the soldered connectioncausescorrosion which diminishes the mechanical load - bearing capacity of the soldered connection
to corrosion of the solder jointscould leadto corrosion of the solder joints
an adhesive agent from sticking to the surface of the circuit ... so that the mechanical load - bearing capacity of the soldered joint breaks down slightly , since no adhesive agent can be provided to increase the load - bearing capacitypreventsan adhesive agent from sticking to the surface of the circuit ... so that the mechanical load - bearing capacity of the soldered joint breaks down slightly , since no adhesive agent can be provided to increase the load - bearing capacity
a soldering defect called bridging , which results from adhesion of the solder to the circuit board so as to connect adjacent chip componentsmay causea soldering defect called bridging , which results from adhesion of the solder to the circuit board so as to connect adjacent chip components
the presence or absence of short circuit(passive) caused bythe presence or absence of short circuit
of phosphorous , copper , and 3 % silverComposedof phosphorous , copper , and 3 % silver
oxidation of the base and filler materialspreventsoxidation of the base and filler materials
corrosion in any loopcausingcorrosion in any loop
metal corrosioncan causemetal corrosion
range Number of solder feed programs 250 conditions ( maxsettingrange Number of solder feed programs 250 conditions ( max