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heat issuescausingsolder failure
Pressure on the broochcan causesolder to break
the circuit board padwill causepoor soldering
For Iron A(passive) is composedSolder - Hard
excessive gold in a solder jointcan causesolder embrittlement
that ... to solder to eithercausessolder embrittlement
Some large electronic componentsmay causede - soldering
eithercausessolder embrittlement
employing all possible agents and the most powerful dissolventsto composeproper solder
of solder alloys(passive) are composedSolder preforms
Excess heatingcausessolder brittleness
heatingto causesolder reflow
the optical elements ... sufficientto causesolder reflow
to seal specific packages(passive) are designedSolder preforms
Elevated temperatures and excessive time at those temperatures during the warm - up and preheating stages can result in inadequate fluxing activity or insufficient protection of solder spheres in the pastecausingsolder balling
Paste particle sizecan influencesolder printability
by the exposure of the base material(passive) caused bysolder wettability
by conventional processes(passive) caused bysolder wettability
Too much solder pastewill causesolder
Rapid heating of soldercausedsolder
to get sufficient heat into the leadto causesolder
of tin and lead alloys(passive) may be composedSolder
to have thixotropic property ( time - dependent shear thinning property(passive) are designedSolder pastes
by molten solder surface tension(passive) caused bysolder
of tin and lead(passive) is composedSolder
of lead or tin(passive) is typically composedSolder
Solder Re - Flow Excessive heathas causedsolder
Sn / Pb ) or lead - free(passive) can be leadedSolder
by a reduction in temperature(passive) caused bysolder
for electronics use(passive) is designedsolder
boardcausingsolder to
of mostly tin and/or lead(passive) is composedSolder
Solder Kwik - Linkdesignedsolder
The previous reflow actionhas causedsolder
by heating(passive) caused bysolder
Sn / Pb(passive) can be leadedSolder
thermal damagemay have causedsolder
by vibration(passive) caused bysolder
by a short circuit Tin furnace temperature(passive) caused bySolder
Thermal fatiguecausessolder
my problemis causingmy problem
problemsto causeproblems
lights to failcausinglights to fail
Most problems(passive) are caused byMost problems
failurecan causefailure
failure of the PCBcan causefailure of the PCB
to loose contactsleadingto loose contacts
from the introduction of the SMT assembly methodresultingfrom the introduction of the SMT assembly method
leaks and produce burning on coppercausingleaks and produce burning on copper
diode failurecausediode failure
device resetscausingdevice resets
ShortCausesShort
I 1 E 1 E 2leadsI 1 E 1 E 2
in attachment between the chip and the substrateresultsin attachment between the chip and the substrate
This Pin(passive) was discovered byThis Pin
a bridge to form between leadscausesa bridge to form between leads
different types of defectscausingdifferent types of defects
failurecausingfailure
a reduction of the adhesive strength of the terminationswill causea reduction of the adhesive strength of the terminations
of Sncomposedof Sn
of Sn and Pbcomposedof Sn and Pb
of 63%Tin and 37%Lead meltscomposedof 63%Tin and 37%Lead melts
of the lasersleadsof the lasers
for electronic usedesignedfor electronic use
to enhance reliability and heat transfer through the reduction of voiding underdesignedto enhance reliability and heat transfer through the reduction of voiding under
to enhance reliability and heat transfer through the reductiondesignedto enhance reliability and heat transfer through the reduction
cracklingcausingcrackling
to meet the voiding requirements of today 's high reliability applicationsare designedto meet the voiding requirements of today 's high reliability applications
to capacitance issuescan also leadto capacitance issues
and qualified for the Mydata MY500 Jet Printerare designedand qualified for the Mydata MY500 Jet Printer
bad joint quality due to insufficient soldercausesbad joint quality due to insufficient solder
to enhance reliability and heat transfer through the reduction of voiding under bottom termination componentsdesignedto enhance reliability and heat transfer through the reduction of voiding under bottom termination components
the low resistance problem(passive) Could ... be caused bythe low resistance problem
to dry solder jointsleadingto dry solder joints
to the pads on the back of the board with the soldering ironleadsto the pads on the back of the board with the soldering iron
connection failures of the solder or chip displacementwould ... causeconnection failures of the solder or chip displacement
free solderleadfree solder
of gold / lead / tin alloy , indium , or indium / tin alloy as the solder materialcomposedof gold / lead / tin alloy , indium , or indium / tin alloy as the solder material
to the pads with the soldering ironleadsto the pads with the soldering iron
without stand - offleadswithout stand - off