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Additionally , solder mask dams can be added between fine pitch padsto preventsolder from bridging
an Insulator Solder mask was designedto preventsolder bridging period
and the stencil would dump too much solder pastecausingsome solder bridging
a close spacing sufficientto reliably preventsolder bridging
printed circuit board ( PCB ) circuitryto preventsolder bridging
Solder resist coatingto preventsolder bridging
a minimum standoff height ... the over - warpingleadsto solder bridging
Solder mask 87 covers most of connecting wire 84 and the outer edge of land 83 as indicated by dashed linesto preventSolder bridging
a Solder Mask Dam ... Another wayto preventSolder bridge
The green coating on the board ... is also usedto prevent/ minimise solder bridging
Soldered components should have adequate solder mask dam widthto preventsolder bridging
The thermal pad ( D2th ) should be greater than D2 of the MLP whenever possible , however adequate clearance ( Cpl & gt ; 0.15 mm ) must be metto preventsolder bridging
A process for making an interconnect assembly , comprising the steps of : producing a circuit board with a multitude of wiring layers ; forming circular copper lands in a wiring layer on a major surface of the board ; making holes in the lands and extending through the board ; selectively depositing copper after drilling to plate the through - holes for connecting the lands to other wiring layers ; forming a rectangular array or grid of round copper contacts larger than the lands , about 0.7 mm in diameter and spaced at about 1.25 mm centers on the major surface and arranged so that four contacts define a square that surrounds each of the lands ; forming a conductor which is narrower than the contacts and narrower than the lands and which extends between each of the lands surrounded by contacts in a diagonal direction in relation to the square of surrounding contacts ; depositing solder resist at least partially covering the conductor and the lands and extending between the contactsto preventsolder bridging
Keep the tip of the soldering iron in parallel with the pins during soldering to the flex circuit boardto preventsolder - bridge
Clad PCB ICLeadsSolder Bridge
Misalignment of the mounting , abnormal solder amount and the loading direction mistake of the flow solderingcould causesolder bridge
The soldermaskpreventssolder - bridging
to separate solderable portions of adjacent leads to a safe distanceto preventsolder bridging
excess solder material(passive) created bysolder bridge
to keep the solderable lead areas at a safe distanceto preventsolder bridging
undesired bridging due to ... too greatto preventbridging by solder
molten solder ... the PCBmay causesolder bridging
undesired bridging due to metal spiking ... too greatto preventbridging by solder
depositing solder resist between the contactsto preventsolder bridging
Polymerpreventsbridging of solder
the tags 26would causesolder bridging
because the leads of the socket can be difficult to reachmay resultin solder bridging
The inner surface of the strain relief bend can be laminated with a metal such as aluminumto preventsolder bridging
to promote the breakaway of excess molten solderto preventsolder bridging
to better execute solder de - bridging - Idealto preventsolder bridging
a second layer of bridge preventing solder resist film is covered on the first layer at least between narrow distance land portionsto preventbridging of solder
promotion of the above - described “ area increase ” such as spreading(passive) is caused bySolder bridge
wicking away of the molten solder between the membersto preventsolder bridging
maximum area for thermal dissipation ... while keeping leads away from the pad areato preventsolder bridging
the ground padto preventsolder bridging
--carefully-- to the sideto preventsolder bridging
the second level package chip attach process(passive) caused bysolder bridging
Solder resist appliedto preventsolder bridging
TrueHeight ® Spacer Blocksto preventBGA solder bridging
A larger gap between the bent terminal section and the capwill preventbridging of the solder
a short circuit between terminals of the componentmay causea short circuit between terminals of the component
a few inches long to the input jack tip , the output jack tip , the circuit input and the wiper of R12leadsa few inches long to the input jack tip , the output jack tip , the circuit input and the wiper of R12
cold solder joints and shorts(passive) caused bycold solder joints and shorts
shorts and creating defective boardscausingshorts and creating defective boards
a short Soldering a NeoPixel ringcausinga short Soldering a NeoPixel ring
with the help of solder maskpreventswith the help of solder mask
to 10vis setto 10v
from decrease of pitch between electrodesresultingfrom decrease of pitch between electrodes
from concentrations in the mounting arearesultingfrom concentrations in the mounting area
The bus address(passive) can be set byThe bus address
when surface tension effects caused by the trailing edge 39 of contact plate 52 drag solder from the cavity volume out to the surface of the mold plate 32may resultwhen surface tension effects caused by the trailing edge 39 of contact plate 52 drag solder from the cavity volume out to the surface of the mold plate 32
of a few large coloniescomposedof a few large colonies
in electrical shorting , package failuremay resultin electrical shorting , package failure
electrically shortcausingelectrically short
alsocausesalso
7)Bad reception(passive) caused by7)Bad reception
and electric isolation of the solder balls 230 are improvedis preventedand electric isolation of the solder balls 230 are improved
undesirable signal errors and chip failurecausesundesirable signal errors and chip failure