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issues with the substratecausedsolder balls to break from it
the padscausingsolder shorts or solder balls
the fine air bubblescan causesolder ball scattering
a matte finishwill resultin fewer solder balls
defects such as components to crack and the solder paste to splattercausingsolder balls during reflow
a solder mask can also interfere with outgassing in the reflow ovencan causesolder ball splatter
this part of the tinwill causesolder ball
on the conductive pad 3(passive) is setThe solder ball
air bubbles thoughtto causespattering of solder balls
increasingsetsthe solder ball
according to a welding temperature profile reference repair(passive) can be setBGA solder balls
by normal printing of solder paste onto PC board(passive) caused bysolder balls
the reflow of solder paste(passive) are caused bySolder balls
your solder pasteis causingthe solder balls
by normal printing of solder paste onto(passive) caused bysolder balls
by normal printing of solder paste(passive) caused bysolder balls
by normal printing of solder paste onto PC(passive) caused bysolder balls
by normal printing of solder paste onto PC Boards(passive) caused bysolder balls
by the normal printing of solder paste onto PC Boards(passive) caused bysolder balls
Application of heatcausessolder balls
of solder alloys(passive) are composedSolder preforms
defects such as components to crack and the solder paste to splattercausingsolder balls
a ball grid array ... , on the bottom of the substratecomposedof solder balls
by a few things in my process(passive) were caused bythe solder balls
by a few things in my process(passive) were causedthe solder balls
by the rapid melting of the SMT paste during reflow(passive) are caused bysolder balls
by the rapid melting of the SMT paste during reflow(passive) are causedsolder balls
Solder bumps 36are composedof solder balls
infrared heatcausesthe solder balls
a number of process parameters(passive) are caused bySolder balls
by the packaging process(passive) caused bysolder balls
something's causingthe solder balls
Both of these factorscan contributeto solder balls
by normal printing(passive) caused bysolder balls
by normal printing of(passive) caused bysolder balls
by the probe contact(passive) caused bythe solder balls
a reflow ovencausingthe solder balls
a re - flow ovencausingthe solder balls
Solder bridges and/ormay causesolder balls
Poor wet - abilitycan causesolder balls
as longerleadsas longer
a shorthas causeda short
circuit problemsmay causecircuit problems
shortscould causeshorts
in short circuits between the ballscould resultin short circuits between the balls
Solder ball causes We dcausesSolder ball causes We d
in solder joint crackingcan resultin solder joint cracking
to reduced connection pitchcan contributeto reduced connection pitch
in a deflected shape with less severe gradientsresultingin a deflected shape with less severe gradients
in gapresultingin gap
assembly reliability issuescausingassembly reliability issues
the welding gas release(passive) caused bythe welding gas release
118leads118
intermittent circuit contactcausingintermittent circuit contact
a short circuitmay ... causea short circuit
to hold up against production with using tin / lead solder anddesignedto hold up against production with using tin / lead solder and
of tin or tin - containingcomposedof tin or tin - containing
118 ... 126 are heated locally so that the heating of one solder joint 150 does not cause heating of other solder joints 150 , such as those on the opposing surface of the interposer 10leads118 ... 126 are heated locally so that the heating of one solder joint 150 does not cause heating of other solder joints 150 , such as those on the opposing surface of the interposer 10
a short and can be eliminated by washing the board with IPAis causinga short and can be eliminated by washing the board with IPA
shorts or intermittent behaviorcan causeshorts or intermittent behavior
of lead - free solder materialcomposedof lead - free solder material
circuit problemsmay causecircuit problems
a weak ball jointcausinga weak ball joint
to electrical failure and other quality concernsoften leadto electrical failure and other quality concerns
of a leadcomposedof a lead
in a more robust solder jointwill resultin a more robust solder joint
to open circuitswill leadto open circuits
severe , unpredictable damagemight causesevere , unpredictable damage
for the pinsdesignedfor the pins
shortscan causeshorts
shortscausingshorts
of at least one of a SnAgCu , SnAg , and SnAu solder materialcomposedof at least one of a SnAgCu , SnAg , and SnAu solder material
a short circuitmay ... causea short circuit
short circuitcausedshort circuit
bridgingcan causebridging
to bonding failure such gap is formedmay causeto bonding failure such gap is formed
in malfunctioning of the electric circuitcan resultin malfunctioning of the electric circuit
to intermittent failuresleadingto intermittent failures
them to fuse togethercausingthem to fuse together
to failing the testcan leadto failing the test