Apr 30 , 2013 Utac Thai Limited Metallic solderability preservation coating on metal part of semiconductor packageto preventoxide US8431484
Also the CPU hit(passive) caused byAlso the CPU hit
shortness of breath , coughing , and damage to the respiratory tractcan causeshortness of breath , coughing , and damage to the respiratory tract
during the corrosion reactioncreatedduring the corrosion reaction
of a material selected from Ti , Zr , Nb , and Al or a layer made of oxide semiconductor composed of a material selected from Ti , Zr , and Nb , wherein the fiber comprising carbon as a main ingredient is disposed on the layer and the fiber comprising carbon as a main ingredient partially containscomposedof a material selected from Ti , Zr , Nb , and Al or a layer made of oxide semiconductor composed of a material selected from Ti , Zr , and Nb , wherein the fiber comprising carbon as a main ingredient is disposed on the layer and the fiber comprising carbon as a main ingredient partially contains
of a material selected from Ti , Zr , Nb , and Al or a layer made of oxide semiconductor composed of a material selected from Ti , Zr , and Nb , and the fiber comprising carbon as a main ingredientcomposedof a material selected from Ti , Zr , Nb , and Al or a layer made of oxide semiconductor composed of a material selected from Ti , Zr , and Nb , and the fiber comprising carbon as a main ingredient
of a material selected from Ti , Zr , Nb , and Al or a layer made of oxide semiconductor composed of a material selected from Ti , Zr , and Nb , ( B ) disposing catalyst particles on the layercomposedof a material selected from Ti , Zr , Nb , and Al or a layer made of oxide semiconductor composed of a material selected from Ti , Zr , and Nb , ( B ) disposing catalyst particles on the layer
comprised also for Featuring economic engineeringM amountcontributedcomprised also for Featuring economic engineeringM amount
in the first layer 2111 as the hole - injecting layer which contains the composite material of the organic compound and the inorganic compoundto resultin the first layer 2111 as the hole - injecting layer which contains the composite material of the organic compound and the inorganic compound
to the progression of myocardial damage in experimental autoimmune myocarditis in ratscontributesto the progression of myocardial damage in experimental autoimmune myocarditis in rats
of non - silica mesoporous oxide comprisingcomposedof non - silica mesoporous oxide comprising
of lead , titanium and zirconiummainly composedof lead , titanium and zirconium
ecological damagecould causeecological damage
a damage degree(passive) caused bya damage degree
you problems as wellmight causeyou problems as well
chip building , galling and weldingpreventschip building , galling and welding
in 17.2-percent efficient solar cells on 4 Ωresultedin 17.2-percent efficient solar cells on 4 Ω
with the respective element ratios being ln/(ln + Zn + Sn + Acomposedwith the respective element ratios being ln/(ln + Zn + Sn + A
Multichannel Tape Machine plug - ins(passive) is designedMultichannel Tape Machine plug - ins
to an inhibition of wound closure significantly and in a dose - dependent mannerledto an inhibition of wound closure significantly and in a dose - dependent manner
to significant damage to nuclear membrane as well as to the mitochondrialedto significant damage to nuclear membrane as well as to the mitochondria
unique designs for each clienthas createdunique designs for each client
of a platinum group element oxide and an anti - corrosion metal oxidecomposedof a platinum group element oxide and an anti - corrosion metal oxide
the joint problem(passive) when caused bythe joint problem
from the LOCOSI processresultingfrom the LOCOSI process
to silicon consumedcreatedto silicon consumed
of silicon nitridecomposedof silicon nitride
a surface blocking(passive) caused bya surface blocking
of ultrathin manganite La0.7Sr0.3MnO3composedof ultrathin manganite La0.7Sr0.3MnO3
the solder from wetting the metalmight preventthe solder from wetting the metal
the solder not to ' stickwould causethe solder not to ' stick
The control gate bottom dielectric layer 222(passive) is composedThe control gate bottom dielectric layer 222
whose color changes(passive) caused bywhose color changes
some problem and short work(passive) caused bysome problem and short work
defects due to oxidesto preventdefects due to oxides
the flux from reacting rheocasting atmospheric and other surface contaminantspreventsthe flux from reacting rheocasting atmospheric and other surface contaminants
process - related contaminationpreventsprocess - related contamination
manufacturing and reliability problems(passive) caused bymanufacturing and reliability problems
the lysis of T. brucei through an unknown mechanismcausesthe lysis of T. brucei through an unknown mechanism