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Qaagi - Book of Why

Causes

Effects

in turncausessignificant power dissipation in the switching network

gate signal ... to be continuously appliedresultingin increase in internal power dissipation

which meanscan be designedphysically smaller in terms of power dissipation

This reduction in voltage swingcausesless dynamic power dissipation

the valley currentcauseslarge static power dissipation

because in order for the RTDs in a Goto cell to have sufficient current drive , the valley current is too largecausinglarge static power dissipation

the GFETsleadsto undesirably large static power dissipation

RDS(ON ) will increasecausingpower dissipation to increase

However , any unused inputs on CMOS ICs will tend to float to a mid voltage levelcausingpower dissipation to increase

This reduction in the voltage levelhas leadto reduced power dissipation

by power dissipation during switching activity [ 4(passive) is causedDynamic ( switching ) power dissipation

by power dissipation during switching activity [ 4(passive) is caused byDynamic ( switching ) power dissipation

Clock distributioncan causesignificant power dissipation

by using such sense resistors(passive) caused bysignificant power dissipation

the clock signalcan resultin reduced power dissipation

driverresultsin reduced power dissipation

The increased efficacyhas ledto reduced power dissipation

the logicresultingin reduced power dissipation

an available maximumis setmaintained by reducing power dissipation

very low voltage swingsresultsin reduced power dissipation

current limiting and thermal shutdown features to protect against output short circuits and bus contention situationsmay causeexcessive power dissipation

current limiting and thermal shutdown features to protect against output short circuits and situations ... bus contentionmay causeexcessive power dissipation

current - limiting and thermal shutdown features to protect against output short circuits and situations ... bus contentionmight causeexcessive power dissipation

automated gated clock insertionshould resultin reduced power dissipation

Current limiting and thermal shutdown features ... output short circuits and bus contentionmay causeexcessive power dissipation

Current - limiting and thermal shutdown features ... bus contentionmight causeexcessive power dissipation

by continuous load current(passive) caused byLoad Dissipation Power dissipation

current limiting and thermal shutdown ... bus contentionmay causeexcessive power dissipation

condition occurscausesexcessive power dissipation

electric can increasecausinglarger power dissipation

Sustained overload operationmay causeexcessive power dissipation

Sustained overload operationcan causeexcessive power dissipation

bus contentionmay causeexcessive power dissipation

that the capacitance of the MOSFET ( that is , its maximum switching speed ) startsto contributeexcessive power dissipation

bus contention or faults(passive) caused byExcessive power dissipation

contentioncould causeexcessive power dissipation

a large valuecausingsubstantial power dissipation

The value of R0will influencethe power dissipation of ADA4870

the resistor divider would slow the switchingcausingextra power dissipation

Random signal activity in combinational circuit during scancan causeexcessive power dissipation

from changes in the state of the componentresultsfrom changes in the state of the component

functionsettingfunction

a rise in temperature of the devicecausesa rise in temperature of the device

large thermal gradients across the diecauseslarge thermal gradients across the die

large thermal gradientscauseslarge thermal gradients

to early power tube failurehave ledto early power tube failure

alsoresultsalso

hot spots that could cause damage the circuitmay causehot spots that could cause damage the circuit

to unacceptable rises in temperature andcan leadto unacceptable rises in temperature and

generallyleadsgenerally

to transmission line model with 50 ohms of real impedance and 0 of imaginarysetto transmission line model with 50 ohms of real impedance and 0 of imaginary

the heating(passive) caused bythe heating

to greater heat dissipationleadsto greater heat dissipation

another exemplary works(passive) designed byanother exemplary works

to energy savingto contributeto energy saving

damaging heatcausesdamaging heat

damaging heatcausesdamaging heat

to energy savingto contributeto energy saving

oftenresultsoften

a suc- cessful amplifierdesigninga suc- cessful amplifier

ultimately ... to your significantly greater operating templeadingultimately ... to your significantly greater operating temp

high heating of the applicationmay causehigh heating of the application

Contact heating(passive) is caused byContact heating

Contact heating(passive) is caused by Contact heating

heatcausesheat

to enhanced chip performanceleadingto enhanced chip performance

the part to operatemay causethe part to operate

the part to operate outsidemay causethe part to operate outside

in excessive die temperaturewill resultin excessive die temperature

in excessive die temperaturewill resultin excessive die temperature

the noisecausesthe noise

the trip pointinfluencesthe trip point

the temperature elevation(passive) caused bythe temperature elevation

from quiescent currentresultingfrom quiescent current

Excessive heat(passive) caused byExcessive heat

a further increase in temperature , a spiraling effect that can lead to failurecausinga further increase in temperature , a spiraling effect that can lead to failure

in temperature differencewill resultin temperature difference

a temperature differencecausesa temperature difference

the part to operate outside guaranteed lf412may causethe part to operate outside guaranteed lf412

the unwanted voltage drop(passive) caused bythe unwanted voltage drop

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