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indentationsresultedin ~12 nm indentation depths and ~140 nm indentation depth
indenter geometryinfluencesthe load - indentation depth curve , hardness and elastic modulus significantly
important technical classification and level systemsleadingto true layer - specific modulus and density measurements of compacted materials
to what extentinfluencesthe resulting nanomechanical properties measured by the Depth Sensing Indentation method
Such sensors , in a manner governed by the design , have to be positioned very close to the area to be measuredcan causedrift , for example thermal drift , and impairs the measurement accuracy of the sensor
/ μm ... the loadcausedan indentation depth of 1 μm as the modulus of elasticity of the hardcoat
the substrate moduluscontributesto the measured elastic contact modulus and its influence on the contact modulus increases as the depth of indentation increases
stored elastic strain energyresultingfrom thermal expansion and elastic modulus mismatch
The chemical thickener ... were observedto contribute heavilyto the elastic shear modulus and temperature sensitivity
Basic principles of elastic and plastic contactinfluencethe measurement of mechanical properties by load and depth sensing indentation methods
normal Tympanometry measures(passive) are ... influenced bynormal Tympanometry measures
from heating the films from 50 � C. to 150 � C.resultsfrom heating the films from 50 � C. to 150 � C.
The DS950H directional module(passive) is designedThe DS950H directional module
dimensional shifts that compromise align - ment tolerances , which need to be kept to 1 ppm , and • Adequate adhesion of device layers during processing and over the device 's lifetimeto preventdimensional shifts that compromise align - ment tolerances , which need to be kept to 1 ppm , and • Adequate adhesion of device layers during processing and over the device 's lifetime
wear in a variety of tribological situationsinfluenceswear in a variety of tribological situations
to an overestimation of the films ' reduced modulus and hardnessleadingto an overestimation of the films ' reduced modulus and hardness
the measurement unit(passive) is designedthe measurement unit
and fabricatedwas designedand fabricated
Gauge for PCB and Floating HeadsettingGauge for PCB and Floating Head
to the indentation size effect ( ISE ) , whereby it is typically found that smaller is strongerleadto the indentation size effect ( ISE ) , whereby it is typically found that smaller is stronger