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Although the total combined thickness of GaN on the starting wafer is considerable , the partially - to - completely isolated lattices of the starting substrate 701 and first layer 705 do not transmit stresses effectivelypreventingcrack formation
Although the total combined thickness of composite layer 507 on the starting wafer is considerable , the partially - to - completely isolated lattices of the starting substrate 501 and first layer 502 do not transmit stresses effectivelypreventingcrack formation
micro grooves _ greater surface resistance to wearing and corrosion due to higher material ratio - shifting of the material fatigue limits due to internal compressive stress and(passive) caused bycrack formation
if practices could be implementedto preventcrack formation
Although it is not possibleto preventcrack formation
creates inner pressurecausingcrack formation
The complex creates invisible protectionpreventingcrack formation
Traumacan also causecrack formation
freezing - thawing cycles(passive) caused bycrack formation
℃ is required prior to hardfacingto preventcrack formation
These micro fiberspreventcrack formation
to the width of microns with uniform spread of wiremesh reinforcement in the body of ferrocement(passive) is preventedCrack formation
It is more elastic , helpspreventcrack formation
four coronal flaring nickel titanium instruments and gates glidden drills(passive) caused bycrack formation
Complete resolidification of liquated grain boundariespreventedcrack formation
Abnormalities in the process or defective semiconductor materials or bothmay also causecrack formation
A good preparation of the substrate in many casespreventscrack formation
Beta alloys are more workable because of the higher stacking fault energy of the BCC phase , which supports the formation of multiple and cross slips upon deformation ,thereby preventingcrack formation
that the thermal mismatch of SU-8 and the substrate material silicon generates high film stress in the spin - coated SU-8causingcrack formation in the microstructures
The stresses induced by rapid acceleration or rapid chamber pressure risecan causecrack formation
thermal coefficient mismatch between the electrode and electrolyte materials(passive) caused bycrack formation
it easyto preventcrack formation
environmental conditions and concrete mixture proportions of which(passive) is influenced byCrack formation
the release of the stress on the silicon nitride Si3 N4(passive) can be prevented byCrack formation
A geopolymer binder can create stronger bonds between these two materials than traditional mortarpotentially preventingcrack formation
the effect of the peripheral layer 3to preventcrack formation
film can be relaxedthereby preventingcrack formation
The formation of stresses in the PMZ , during subsequent weld coolingcan causecrack formation
so many internal tensionswould causecrack formation
the straincausingcrack formation
polished with olive oilto preventcrack formation in it
Industrial Science And Technology Processto preventcrack formation
base plates ... reinforcedto preventcrack formation
is restoredto preventcrack formation
the flatten - close tests compared with the alloys of the present invention(passive) caused bycrack formation
When the average functionality of the alkoxy silane mixture is too large , the coating solution prepared from such an alkoxy silane mixture can hardly give a coating layer having a sufficiently large thickness by a single coating in addition to the appearance of brittleness in the coating layer eventuallyto causecrack formation
the heat cycle(passive) caused bycrack formation
small and large pyramids are offsetto preventcrack formation
in a bright xenon short arc lamp with increased xenon gas pressure(passive) is also preventedCrack formation
firing gradually up to at least 225 degrees C.to preventcrack formation
Lamb wave mode conversioncreatesLamb wave mode conversion
from the holeoriginatesfrom the hole
to a higher crystal quality within the domainsleadsto a higher crystal quality within the domains
to potholeslater leadingto potholes
from the rough substrate morphologyresultingfrom the rough substrate morphology
with equal force warp - wise and weft - wise , and delay in sensing tensile forces is excluded extended service life of buildings and facilities without renovationis preventedwith equal force warp - wise and weft - wise , and delay in sensing tensile forces is excluded extended service life of buildings and facilities without renovation
to energy releaseleadsto energy release
to leakage issuesmay leadto leakage issues
in dielectric breakdownwould resultin dielectric breakdown
in the semiconductor material 5is causedin the semiconductor material 5
from rebar corrosion - induced concrete expansionresultingfrom rebar corrosion - induced concrete expansion
The Draugen leak(passive) was caused byThe Draugen leak
The fission gas release from the HBS during an accident is assumed(passive) to be caused byThe fission gas release from the HBS during an accident is assumed
to rupture of healing agent microcapsules , which would then come in contact with exposed catalyst particles to polymerize within the crackwould leadto rupture of healing agent microcapsules , which would then come in contact with exposed catalyst particles to polymerize within the crack
to failure as the plates ageleadsto failure as the plates age
therefrom....http://www.google.com/patents/US5326396?utm_source=gb-gplus-sharePatent US5326396 - Low shrinkage cementresultingtherefrom....http://www.google.com/patents/US5326396?utm_source=gb-gplus-sharePatent US5326396 - Low shrinkage cement
to a reduction in lusterleadsto a reduction in luster
to emission of signals with an amplitudes of up to 4 Vleadsto emission of signals with an amplitudes of up to 4 V
alsoresultsalso
to a high resistivityleadingto a high resistivity
various chemical mechanisms(passive) are triggered byvarious chemical mechanisms
from the loss of reinforcement bondresultingfrom the loss of reinforcement bond
from loadsresultingfrom loads