Loading ...
Its unique and diverse physical propertiesresultin low bulk density , a rapid dissolving rate , exceptional flow characteristics , strong blendability , unmatched liquid adsorption and a
Significant lattice mismatchwill causehigh interface stress and high dislocation density in the resulting semiconductor device
Porosityinfluencesmany properties like thermal conductivity , strength , bulk density , durability etc
variations in liquor composition and sub - optimal combustion conditionscan leadto substantial differences in sustainable heat and solids input rates , for geometrically similar boilers
The devicesdesignedfor use in powdery and fine - grained bulk solids work according to vibrating fork principle
the polymerresultingin enhanced beta phase nucleation in PVDF and a large dielectric constant of the thin films
model systemsdesignedto produce different elastic , plastic and thermal mismatches across the interfaces
the swelling ratio as the slip conditioncausesthe different wall shear stresses at the interfaces between the solids and the water
the surfaceresultin very low interface thermal resistance and high thermal conductivity
by active growth(passive) caused byinterfacial deformations on soft surfaces and liquid interfaces ... , particularly over long time scales
these spacescauseobstruction between adjacent solid particles and reduce thermal conductivity in an overall
Al2CuLi ) phase during subsequent aging treatmentresultingin high - density fine T1 phases and thin precipitate - free zone within DAT alloy
an insulating filmcomposedof SiO2 , both a good interface and a high dielectric constant
The expositionleadsthe reader ... that have particular purposes in continuum ( thermo- ) mechanics of solids and fluids , electrically ( semi-
for voice clarity(passive) is designedSolid annealed , highly pure and conductive bare copper of 0.4 / 0.5 daimeter insulated with high density polyethylene
a gasresultsin an extremely low - density solid that features low thermal conductivity
recommend fuelsseton many Thermal Properties of Solids and unavailable
Thermoplastic rubber insulating material is permanently molded to the core and coil assembly on both designsresultingin a compact unit with excellent mechanical , thermal , and dielectric characteristics
The structural distortioncausesweaker interlayer coupling , which makes its bulk material behave electronically and vibrationally like decoupled monolayers
Spin polarized transportresultedin unusual magnetoresistance behavior in ferromagnetic nanowire attached to bulk superconductors
Multiple phonon processescontributingto inelastic scattering during thermal boundary conductance at solid interfaces
Numerous particlescale mechanismsinfluencethe bulk behaviour and flow of bulk materials
Several factorsinfluencethe heat transfer across solid interfaces
Breaking network connectivityleadsto ultralow thermal conductivities in fully dense amorphous solids
locally(passive) can be setThermal characteristics for fluids and solids
to about 0.5 eV transport gap variations across organic filmsleadingto about 0.5 eV transport gap variations across organic films
to lower source / drain capacitanceleadingto lower source / drain capacitance
in inaccurate material temperaturesresultingin inaccurate material temperatures
to lower source / drain capacitance , lower leakage and latch - up immunityleadingto lower source / drain capacitance , lower leakage and latch - up immunity
Cheering with its part of Manchuria in 1931to leadCheering with its part of Manchuria in 1931
in an almost linear dependence of the impedance of the plasmonic transmission line on the thickness of the insulator layerresultingin an almost linear dependence of the impedance of the plasmonic transmission line on the thickness of the insulator layer
to the internal stresswill leadto the internal stress
to the fundamentals of semiconductor materials and the p - n junctionleadingto the fundamentals of semiconductor materials and the p - n junction
to a distinctive attention during recent yearshave leadto a distinctive attention during recent years
Four placebo formulations(passive) were designedFour placebo formulations
The sheet(passive) is composedThe sheet
in significant residual interfacial strainsresultin significant residual interfacial strains
in significant residual interfacial strains upon cooling to ambient temperatureresultin significant residual interfacial strains upon cooling to ambient temperature
it to break apartcausingit to break apart
to this approachleadingto this approach
to breakdownmay leadto breakdown
The optically transparent plate 709(passive) can be composedThe optically transparent plate 709
The differences(passive) is caused byThe differences
stronglycan ... influencestrongly
alsocan ... leadalso
alsocan ... contributealso